Pre-oxidised and Pre-diced

standardised substrate size of 15 mm x 20 mm

Silicon substrates designed for use in organic electronics labs as FET substrates, and other applications including X-ray studies, surface microscopy analysis and elipsometry measurements. Sold on 200 mm wafer mounts, pre-oxidised and pre-diced to our standardised substrate size of 15 mm x 20 mm with no photoresist coating, these substrates fit in our substrate rack and makes batch cleaning and processing much faster and simpler.

Product code	Oxide (nm)	Dicing	Resistivity (Ω cm)	Usage
S146	300	Diced	<0.02	OFETs with a robust electro-mechanical gate insulator (suitable for use with gold electrode evaporations)
S147	400	Diced	<0.02	X-ray measurements, microscopy and ellipsometry
S148	90	Diced	<0.02	Optical microscopy of 2D materials

Individual silicon oxide substrate (300 nm oxide).

Wafer Specifications

Wafer diameter	200 mm (8")
Oxide thickness tolerance	/- 5% (both sides)
Oxide growth	Thermally grown (dry) on both sides
Wafer type / dopant	P / Boron
Wafer thickness	725 /- 25 µm
Wafer growth	Czochralski (CZ)
Orientation	<1 0 0>
Front surface	Polished
Back surface	Unpolished

Dicing Specifications

Substrate size	20 mm x 15 mm
Substrates per wafer	Approx. 75 complete substrates (plus partial edge pieces)
Wafer protection	None

Cleaning routine

As with all organic electronic devices, getting a clean substrate is essential for high performance. Our pre-diced substrates make batch cleaning easier by use of a substrate rack. These wafers can be cleaned with the following routine: